講座通知:5G高頻器件先進封裝技術

作者:本站編輯點擊:525時間:2019-12-06

題目:5G高頻器件先進封裝技術

報告人:馬盛林

時間:2019年12月10日上午9:30

地點:武漢大學雅各樓116會議室

歡迎各位師生踴躍參加!

 

摘要:

5G將啟用更多高頻段,這些高頻器件如何封裝集成?未來趨勢如何?本講做將在回顧5G高頻器件封裝集成技術現狀基礎上,介紹課題組在高頻TSV/TGV互連、TSV IPD元件以及TSV 2.5D/3D射頻集成應用方麵的研究進展。

5G will adopt more high frequency bands. what kinds of package technology will used for these emerging High frequency devices? What's the trend in future development? This lecture will briefly review the state art of package technology adopted in 5G RF devices, expand the research progress of high-frequency TSV/TGV interconnection, TSV IPDs, and TSV 2.5D/3D RF integration application.

 

主講人簡介:

2012年7月畢業於北京大學,獲微電子學與固態電子學專業博士學位、“北京大學優秀畢業生”、“北京市優秀畢業生”。2012年8月起在廈門大學機電工程係工作,2017年2018年陸續受聘為學副教授、博士生導師,2018年1月起至現在受聘為北京大學微米/納米加工技術國家級重點實驗室客座研究員。主要從事IC先進封裝(TSV、3D SIP)、三維射頻微係統集成、AlN超聲波器件、植入電子微係統封裝等方向研究工作,承擔多項國家級重點課題任務,包括國防973項目、02國家科技重大專項、原總裝備部預研項目、裝備發展部預研項目、國家自然科學基金項目等;累計發表論文30餘篇(SCI/EI檢索),獲得1項PCT專利、2項美國發明專利授權、10餘項中國發明專利授權和2項台灣發明專利授權,指導研究生4人次獲得學術會議最佳論文獎。

He received the Ph.D. degrees in microelectronics engineering from Peking University in 2012, with the honor of Outstanding Graduates from Peking University and Outstanding Graduates from Beijing. Since August 2012, he joined the Department of Mechanical and Electrical Engineering of Xiamen University, employed as an associate professor and doctoral tutor in 2017 and 2018 successively. He has also been employed as a guest researcher at the National Key Laboratory of Micro / Nano Machining Technology at Peking University since January 2018. His current research interests include IC advanced packaging (TSV, 3D SIP), 2.5D/3D RF integration, AlN based ultrasonic devices, and implanted electronic micro-system packaging, has won funding from many major projects, such as, National Science and Technology Major Project of the Ministry of Science and Technology of China, National Defense Pre-Research Foundation of China, and National Natural Science Foundation of China, has published more than 30 journal and conference publications (SCI / EI), has 1 PCT patent, 2 US invention patent authorizations, more than 10 Chinese invention patent grants, 2 Taiwan invention patent grants, and 4 papers winning the best paper award at academic conferences.